April 18, 2026
Headlines
Gears
MWC 2026: Luo Wei Hints at Major Honor Surprise Beyond Magic V6
Honor’s Chief Imaging Engineer, Luo Wei, posted an article today, previewing MWC 2026. He stated that at this year’s MWC, Honor will announce more than just the Magic V6 and the Radish phone; there’s something even bigger to announce. According to official teasers from Honor yesterday, the Honor MWC 2026 Global Launch Event will officially…
Microsoft Unveils Harrier AI Models, Tops Benchmark Ahead of Google
Microsoft’s Bing team published a blog post on April 7 announcing the open-source release of Harrier AI, an industry-leading text embedding model series, to meet the high standards of information processing required by modern AI intelligent agent systems. This model ranked first in the multilingual MTEB-v2 benchmark. Note: Embedding models are a technique that converts…
AI and Job Cuts Continue to Rattle US Tech Workers
According to a report by Business Insider today, U.S. employee confidence declined again in February, with those in the technology sector experiencing the lowest morale. According to the latest Employee Confidence Index released by Glassdoor, a recruitment and workplace assessment platform, the proportion of U.S. employees who are optimistic about their company’s prospects over the next…
Links Releases LC2314 Mini PC Featuring AMD Zen+ Processor
Japanese company, Links, on Friday, announced the launch of the LC2314 mini PC, powered by an AMD Ryzen Embedded R2314 processor. Tech Free Press understands that this processor is based on the “Zen+” microarchitecture and features a 4-core, 4-thread design. The R2314 measures 100×100×34 (mm) and features 8GB of single-channel DDR4-2666 SODIMM memory (no extra…
AI
Phones
Apple’s iPhone Fold Foldable Phone Mass Production Delayed By 2 Months
Digitimes, citing supply chain sources, indicated yesterday (April 13) that…
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Leak Design of Huawei’s Pura X Max Horizontally Foldable Phone
Huawei’s official Weibo account released another teaser video of the…
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Xiaomi Releases REDMI K90 Max, First Phone with Built-in Cooling System on April 21st
Xiaomi officially announced today that the REDMI K90 Max will be released on…
Read More Former iQOO Manager Explains Decline of Mid-Range LCD Phones
Ma Yulun, former product manager of the iQOO Z series,…
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Xiaomi Offers Limited Custom Magnets to Early SU7, YU7 Owners
According to @LazySauce’sDiary, Xiaomi is giving away customized refrigerator magnets…
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OPPO Find N6 Touted World’s Thinnest Foldable Phone
At today’s foldable screen crease-free technology communication conference, OPPO introduced…
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Apple Abandons Plan for Clamshell iPhone Flip Model
Apple has reportedly abandoned the plan for a small flip-style…
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Google Pixel 11 Pro Fold Renders Reveal Slimmer 10.1mm Design
Google is expected to release its next-generation foldable phone, the…
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accessories
hardwares
Gaming
Computers
Microsoft Quietly Launches Dedicated Upgrade Assistant for Windows 11 25H2
Nearly six months have passed since the large-scale rollout of…
Honor MagicPad3 Pro Reveals Linux Interface With One-Click “Shrimp Farming” Support
Lin Lin, Minister of Smart Life Business Department of Honor…
Mechrevo 15 Pro 2026 Slim Gaming Laptop Now Available: 356H + 5060
The Mechrevo 15 Pro 2026 ultra-thin gaming laptop is now…
MacBook Neo Drops to 2,699 RMB With 700 RMB Trade-In
JD.com’s self-operated Apple product trade-in subsidy continues, with great prices…
ClickFix Attacks on Mac Users Surge 500% After Windows Switch
AppleInsider published a blog post yesterday (March 10) reporting that hackers…
SK Hynix Unveils World’s First 1-Cell LPDDR6 Memory Chip
SK Hynix has just announced the successful development of a…
