Xiaomi Releases REDMI K90 Max, First Phone with Built-in Cooling System on April 21st

Xiaomi Releases REDMI K90 Max, First Phone with Built-in Cooling System on April 21st

Xiaomi officially announced today that the REDMI K90 Max will be released on April 21st at 7 PM. The official promotional tagline is:

Performance Demon King, Exploring New Limits of Performance

Dual-core air cooling, redefining the standard of heat dissipation

Screen, touch, and battery life: a comprehensive upgrade in experience.

Witness the all-new “flagship gaming performance”!

According to previous reports, the REDMI K90 Max features Xiaomi’s first active air-cooling solution, a new generation of dual-core processors, and a 165Hz high refresh rate gaming screen.

In terms of specifications, the new unit features an independent sealed air duct and an all-metal bearing structure, supporting IP66/IP68/IP69 dust and water resistance, passing a 50,000-hour aging test, and offering a 6-year fan warranty and lifetime cleaning and maintenance.

It boasts a large-size fan with a diameter 6% larger than mainstream designs, featuring a vertical air intake design and forward-tilted blades for pressurized airflow. The airflow reaches 0.42 CFM per minute, 1.3 times that of competitors. In high-speed, powerful cooling mode, it can reduce the temperature by 10°C in 100 seconds.

In addition, the REDMI K90 Max still features dual stereo speakers co-branded with Bose, located on the top and bottom sides of the device, forming a symmetrical stereo design.

See more photos below…

Xiaomi Releases REDMI K90 Max, First Phone with Built-in Cooling System on April 21st

Xiaomi Releases REDMI K90 Max, First Phone with Built-in Cooling System on April 21st

Xiaomi Releases REDMI K90 Max, First Phone with Built-in Cooling System on April 21st

Xiaomi Releases REDMI K90 Max, First Phone with Built-in Cooling System on April 21st

Share This Article: